Templetronics


Go to content

High Speed Digital, SI, EMC

Projects > Project Overviews

Here are the projects that Templetronics expertise has successfully designed in the past with regard to EMC, Signal Integrity and High Speed Digital design.



through hole printed circuit board

In the following projects, you will find a segmentation of our input into EMC, High Speed Digital and Signal Integrity on projects. Despite compartmentalistion and seperation by catagorically listing these considerations are heavily integrated due to physical laws.

Avionics Control System
Avionics Multi Purpose Embedded Processing System
Commercial Communications System
4G/LTE Basestation
Remote Telemetry Unit (RTU) System
Multi-processor vibration monitoring and analysis system
Engine Monitoring System (data acquisition & frequency analysis system
Brushless DC-motor controller, prototype board
Brushed DC-motor controller board (prototype and production)
Various analogue and mixed signal designs




Please see the Testimonials' page regarding our input.

Avionics Control System

Project: Airborne Primary Flight Control Surface
Considerations: EMC, high speed digital design , signal integrity, high data rates
Description:
High Speed Digital & SI:
Hardware design of electronics around a Freescale/NXP CPU and MicroSemi FPGAs. Custom digital PCB, with backplane interface to peripherals such as ADCs and DACs on separate analogue PCB, and power PCB, linked across a backplane connected via LVDS. Not as high speed as some of our designs, but high density in terms of signals and control busses due to the number of sensors and interfaces, and thus the need to maintain signal integrity and successful data transmission in a system with mixed low and high-power technologies in close proximity, as well as minimal interference in sensor signals. POL converter supplies on digital board, and dedicated power delivery PCB for power circuits.

EMC:
Built in protection and mitigation against emissions and subseptability, and partition and segmentation of the design by function ensured successful system and design performance in both analogue and digital domains, and integrity of the system including separation of off-board signal protection and robustness to lightning strike by location and device selection.
Design to applicable to DO160G sections.

Back to Top
Back to Projects Overview

Avionics Multi Purpose Embedded Processing System

Project
: Airborne Embedded Systems
Considerations: EMC, high speed digital design , signal integrity, Gbps transmission/high data rates
Description:
High Speed Digital & SI:
Hardware design of electronics around a multi-core network Freescale QorIQ family communications processor (two variants) with multiple-interfaces ranging from low speed local control interfaces through GbE to 2.5Gbps PCIe Gen1/2, SATA and USB2.0 across VITA46 backplane and VITA 42 daughterboard standards electrical transmission as part of a multi-board modular system.


A challenging design due to the small form factor card, densely populated card transmitting multi Gbps signals off card, and with 30A power supplies required by the CPU.
EMC:
applicable to DO160G sections.

Back to Top
Back to Projects Overview

Commercial Communications System

Project: Commercial Communications System
Considerations: EMC, high speed digital design , signal integrity, Gbps transmission/high data rates
Description:
High Speed Digital & SI:
Hardware design of electronics around a dual-core communications processor with multiple-interfaces ranging from low speed (400kbps local control interfaces) through GbE to 2.5Gbps electrical transmission as part of a multi-board modular system.
Layout liaison with third party PCB engineers.
PCB stack-up (16 layer) and layer allocation, local PCB and interface signal integrity, low jitter, minimum SSO, low phase noise clock selection and transmission.
Working with 3rd party signal integrity group to optimize to evaluate on and off-board Gbps interconnects.
Design to VITA 57 mezzanine, 802.3-2002

EMC:
Component selection driven for EMC performance.
Power supply efficiency and layout for lower radiated emissions.
Interface transient protection.
Consultation and analysis on both PCB and system EMC (immunity and emissions), system & PCB grounding.
Guidance on electromechanical system design and interaction
Design to applicable IEC standards: IEC EN 61000-4-2/-5/-11; FCC 15 Class B; ITU k.43; EN550022

Back to Top
Back to Projects Overview


4G/LTE Basestation

Project: 4G/LTE Basestation
Considerations: EMC, high speed digital design , signal integrity, Gbps transmission/high data rates
Description:
High Speed Digital & SI:
Hardware design of electronics around a multi-core network processor with multiple-interfaces ranging from low speed (400kbps local control interfaces) through GbE to 6.25Gbps optical and electrical transmission as part of a multi-board modular system.
Layout liaison with third party PCB engineers.
PCB stack-up (14 layer) and layer allocation, local PCB and interface signal integrity, low jitter, minimum SSO, low phase noise clock selection and transmission.
Working with client signal integrity group to optimize short and long range 6Gbps+ digital transmission through use of interface modelling (SERDES & channel).

EMC:
Component selection driven for EMC performance.
Power supply efficiency and layout for lower radiated emissions.
Interface transient protection.
Consultation and analysis on both PCB and system EMC (immunity and emissions), system & PCB grounding.
Lightning & transient mitigation of unit to IEC EN 61000-4-5/CISPR22 & BellCore G1089
Transient mitigation of interfaces, and ESD resistance (IEC EN61000-4-2) of devices
Design to applicable IEC standards: IEC EN 61000-4-2/-5/-11; ITU K.20/.34/.37/.40/.42/.43/.45/.67; EN550022

Back to Top
Back to Projects Overview

Remote Telemetry Unit (RTU) System

Project: Remote Telemetry Unit (RTU) System
Considerations: EMC, high speed digital design, signal integrity
Description:
High Speed Digital & SI:
Signal integrity analysis on heavily loaded, low buffer strength ARM9 network processors part of the PCB design, ensuring HSTL SDRAM voltage margins and timing windows on multi MegaHertz clocked SDRAM interface. Validation of interface through IBIS modelling.
Full PCB stack-up design responsibility, constraint entry, PCB layout supervision.

EMC:
Component selection driven for EMC performance.
Power supply efficiency and layout for lower radiated emissions.
Interface transient protection.
System was designed as right first time, passing into production without redesign, and passing all EMC tests (conducted and radiated immunity and emissions tests)
Design to applicable standards: IEC EN 61000-2/-5/-11; EN550022,


Back to Top
Back to Projects Overview

Multi-processor vibration monitoring and analysis system

Project: Multi-processor vibration monitoring and analysis system
Considerations: high speed digital design , signal integrity, EMC.
Description:
High Speed Digital & SI:
This project required high bandwidth DSPs and microprocessors to achieve >450MFLOP performance, and also high bandwidth PC 2100 DDR memory data-rates at 200MHz. Using a 12 layer board, IBIS modelled interfaces, constraint driven design and close liaison with the chosen PCB vendor we, designed a right-by-design powerful DSP processing engine to delight the customer, with all interfaces performing as the system requirements. We used a registered DIMM approach to design a DDR SDRAM interface to achieve JEDEC timings across the extended temperature range and best-practice high speed design practices to deliver a low emission design for aircraft qualification. Our first 10/100 Ethernet PHY interface operated as intended allowing the customer to upgrade the system over an Ethernet link and download stored data.
EMC:
Board was designed for low EMI using industry standard techniques.
Design to applicable DO160E sections

Back to Top
Back to Projects Overview

Engine Monitoring System (data acquisition & frequency analysis system)

Project: Engine Monitoring System (data acquisition & frequency analysis system)
Considerations: high speed digital design , signal integrity, EMC.
Description:
High Speed Digital & SI:
Right at the outset we were able to design in good design practices for low EMC, good signal integrity and good high speed digital design techniques into a production project. This design was difficult because it contained both sensitive analogue measurement circuitry, dense high speed digital circuitry and was very constrained in the layout and PCB construction. However, by following best practice design methods such as isolation, separation, ground planes, shielding, constraint driven design for the PCB, attention to placement, routing, low impedance components, liberal decoupling, terminations and application of our knowledge and experience, we achieved a precision mixed signal design, that gave both 12 and 14 bit resolution in the presence of fast digital circuitry and maintaining successful digital signal integrity.
EMC:
Board was designed for low EMI using industry standard techniques.

Back to Top
Back to Projects Overview

Brushless DC-motor controller, prototype board

Project: Brushless DC-motor controller, prototype board
Considerations: EMC problem solving, signal integrity
Description:
EMC:
Our design expertise contributed towards solving EMI problems (conducted emissions) in the prototype control system for the above project. Discovering that the use of many high power SMPSU units was tanking noise into sensitive analogue conditioning circuitry, application of a combination of a custom differential PI filter and torroid based Common Mode filter reduced the conducted noise to 1/6th its original level. It was also discovered that the on-board SMPSU chips were behaving oddly due to a stability problem in the control loop, giving burst noise in a frequency above the PSRR of the op-amps was causing problems in the control system. Curing this problem led to an uncontaminated demand signal in the controller.
Applicable standards: DO160D applied to full system

Back to Top
Back to Projects Overview

Brushed DC-motor controller board (prototype and production)

Project: Brushed DC-motor controller board (prototype and production)
Considerations: high speed digital design , signal integrity, EMC
Description:
Our design expertise was involved right from concept of the board and system. We provided a high speed digital design that was 20dB lower than the original system with an 8x faster clock frequency than the original system. We achieved this by applying best practice methods such as controlled impedance layers, multi-layer board stack-up, terminations, control over routing, placement, separation, low impedance components and routing, proper decoupling to ensure the best performance from the board. All this came with the added complexity of having analogue circuitry, power circuitry and an unique and complex PCB shape to contend with. We also consulted on the best implementation of a serial communications link, from an electrical perspective to ensure that the customer protocol was met.
Applicable standards: MIL-HBK-461

Back to Top
Back to Projects Overview

Various analogue and mixed signal designs

Project: Various analogue and mixed signal designs
Considerations: EMI avoidance, signal integrity
Description:
At the outset, our expertise was responsible for the design of two complex electronic board designs. We were able to ensure that both designs were designed and proven to perform as intended by ensuring minimum interference to analogue circuits from nearby digital and power circuitry, adequate transient protection of both low power and high power circuits to minimise susceptibility to ESD in service and in manufacture, thereby increasing reliability, ensuring data lines were protected from glitches, and noise did not cause false operation of a circuit.


For more information, please refer to the Analogue Projects page, Digital ASIC & FPGA Projects page, Embedded System Project page and the Mixed Signal Projects page.

Back to Top
Back to Projects Overview


Integrated circuit and field flux on a PCB
electronics power supply waveforms and noise
Digital circuit switching waveforms and noise on an oscilloscope
plated through hole PCB
IC and emissions above a PCB ground plane
Power supply waveforms on an oscilloscope
Switching noise adn waveforms on an oscilloscope
plated through hole vias on an electronics  PCB
power supply waveforms
IC and emissions field above a ground plane
Switching noise and waveforms on an oscilloscope
Plated through hole vias on a printed circuit board
power supply waveforms
Integrated circuits and emissions above a PCB ground plane

We use cookies to help maintain and improve our website.

Click the following links for our Terms of Use and Privacy and Cookie policies

The PCB image on this page is used on this website by kind permission under the terms of www.freeimages.co.uk

Home | Company | Design Services | Projects | Information | Contact | Site Map


Sub-Menu:


Back to content | Back to main menu